摘要：采用乙二胺作辅助配位剂在芳纶纤维上化学镀银，制备镀银导电Kevlar(凯夫拉)芳纶纤维。分别采用分析天平、扫描电镜(SEM)、X 射线衍射(XRD)和万用表，研究了乙二胺对化学镀银层的增重率、表面形貌、晶体结构和表面电阻的影响，并探讨了化学镀银层的生长过程。结果表明，加入乙二胺后，镀液稳定性增强，纤维增重率提高到50%左右，表面电阻降低至0.3 ~ 0.4 Ω/cm，同时颗粒尺寸变大，抗老化性能增强。银镀层呈三维形核生长，颗粒尺寸随镀覆时间延长而增大，镀层外观也经历了由黑色到银灰色再到白色的转变过程。
Effect of ethylenediamine on electroless silver plating on aramid fiber
ZOU Xin-guo, LIANG Jing-jing, ZHANG Hui-ru, TANG Zhi-yong, SUN Jin-liang, REN Mu-su
Abstract: Conductive Kevlar aramid fiber was prepared by electroless silver plating using ethylenediamine as auxiliary complexing agent. The effect of ethylenediamine on weight gain rate, surface morphology, crystal structure and surface resistance of silver-coated Kevlar fiber was studied by
analytical balance, scanning electron microscopy (SEM), X-ray diffraction (XRD) and multitester. With the addition of ethylenediamine, the plating bath stability was improved, and the weight gain rate of fiber was increased to 50% while the surface resistance of fiber was reduced to 0.3-0.4 Ω/cm. Meanwhile, aging resistance of the silver coating was improved due to the increasing grain size. The growth mechanism of silver coating was found to follow the threedimensional nucleation. The grain size was increased with increasing deposition time, and the color of silver coating changed from black to silvery grey to white.
Keywords: aramid fiber; electroless silver plating; ethylenediamine; growth morphology
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