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180101丨电铸金添加剂对3D 硬足金工艺产品的影响

   日期:2018-01-31     作者:电镀与涂饰    浏览:748    评论:0    
核心提示:中文核心期刊,中国科技核心期刊! DOI: 10.19289/j.1004-227x.2018.01.001电铸金添加剂对3D 硬足金工艺产品的影响李小军*,程臻
 
中文核心期刊,中国科技核心期刊!
TIM图片20180130085640

DOI: 10.19289/j.1004-227x.2018.01.001

电铸金添加剂对3D 硬足金工艺产品的影响

 

李小军*,程臻君,陈建飞,江建平,王源平,朱卫峰(深圳市安普检测技术服务有限公司,广东 深圳 518000)

摘要:以含有20 ~ 35 g/L 氰化亚金钾和80 g/L 磷酸盐的电铸金溶液为基础,在pH 6.5 ~ 6.8、温度40 °C、电流密度0.4 A/dm2和电镀时间12 h 的条件下,对比研究了分别采用氨基羧酸盐体系添加剂和有机多膦酸盐体系添加剂时所得铸金层的表面形貌、纯度、显微硬度和电流效率。结果表明,采用有机多膦酸盐添加剂时,阴极电流效率为92.01%,比采用氨基羧酸盐体系添加剂时高19.99 个百分点,所得3D 硬足金产品外观均一,结晶细致,显微硬度为97 HV,纯度为100%。

关键词:硬足金;电铸;多聚膦酸盐;氨基羧酸盐;表面形貌;显微硬度;纯度;电流效率

中图分类号:TQ153.18 

文献标志码:A 

文章编号:1004 – 227X (2018) 01 – 0001 –04

Effect of additive on properties of electroformed 3D hard pure gold product

//LI Xiao-jun*, CHENG Zhen-jun, CHEN Jian-fei, JIANG Jian-ping, WANG Yuan-ping, ZHU Wei-feng

Abstract:Gold electroforming was carried out under the conditions of pH 6.5-6.8, temperature 40 °C, current density0.4 A/dm2 for 12 hours from a basic bath containing 20-35 g/L potassium gold cyanide and 80 g/L phosphate. The surfacemorphology, purity, and microhardness of gold coating as well as current efficiency when using polyphosphonate and amino carboxylate respectively as additive were comparatively studied. The cathodic current efficiency is 95.01% when

using polyphosphonate additive, 19.99 percentage points higher than that achieved when using amino carboxylate additive.

The electroformed 3D hard gold product features a uniform appearance, fine and compact crystallization, a microhardness

of 97 HV and a purity of 100%.

Keywords:hard pure gold; electroforming; polyphosphonate; amino carboxylate; surface morphology; microhardness;purity; current efficiency

First-author’s address:metal Surface Treatment Research Lab of Anpu Testing Technology Services Co., Ltd.,Shenzhen 518000, China

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