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180104丨木塑制件化学镀铜工艺研究

   日期:2018-01-31     作者:电镀与涂饰    浏览:4492    评论:0    
核心提示:中文核心期刊,中国科技核心期刊! DOI: 10.19289/j.1004-227x.2018.01.004木塑制件化学镀铜工艺研究李健,袁国栋,郭艳玲,陈晖
 

中文核心期刊,中国科技核心期刊!


 

 

 

DOI: 10.19289/j.1004-227x.2018.01.004

木塑制件化学镀铜工艺研究

 

 

 

李健,袁国栋,郭艳玲,陈晖,李三平*,李兴东,孙宇(东北林业大学机电工程学院,黑龙江 哈尔滨 150040)

摘要:对选择性激光烧结(SLS)木塑制件依次进行填孔(渗蜡或渗树脂)、打磨和银氨溶液活化后再化学镀铜。化学镀铜的工艺条件为:五水合硫酸铜15 g/L,乙二胺四乙酸二钠20 g/L,酒石酸钾钠15 g/L,亚铁氰化钾0.01 g/L,37%的甲醛15 mL/L,氢氧化钠适量,pH 11.5,温度50 °C,装载量3 dm2/L,时间30 min。研究了不同填孔前处理工艺及活化时间对化学镀铜层厚度的影响。获得了均匀、致密,厚度为5.46 μm,结合力为0 级,表面电阻率为0.054 Ω 的铜镀层。

关键词:木塑复合物;化学镀铜;填孔;渗树脂;活化;厚度;结合力;导电性

中图分类号:TQ153.14; TB332                

文献标志码:A                  

文章编号:1004 – 227X (2018) 01 – 0013 – 05

Electroless copper plating of wood–plastic composite parts //LI Jian, YUAN Guo-dong, GUO Yan-ling, CHEN Hui,LI San-ping*, LI Xing-dong, SUN Yu

Abstract:Electroless copper plating was conducted on wood–plastic composite parts produced by selective laser sintering

(SLS) after pore filling (wax or resin infiltration), polishing, and activation with silver ammonia solution. The bath

composition and process conditions for electroless copper plating are as follows: copper sulfate pentahydrate 15 g/L,

disodium ethylenediaminetetraacetate 20 g/L, potassium sodium tartrate 15 g/L, potassium ferrocyanide 0.01 g/L,

37wt.% formaldehyde 15 mL/L, sodium hydroxide as required, pH 11.5, temperature 50 °C, loading capacity 3 dm2/L, and

time 30 min. The effects of different pore filling pretreatment processes and activation time on the thickness of electroless

copper coating were studied. Uniform and compact copper coatings with a thickness of 5.46 μm, 0-grade adhesion strength,

and a surface resistivity of 0.054 Ω were obtained.

Keywords: wood–plastic composite; electroless copper plating; pore filling; resin infiltration; activation; thickness;

adhesion; conductivity

First-author’s address:

School of Mechanical and Electrical Engineering, Northeast Forestry University, Harbin 150040,China

 

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