李玉婷1, 2，代明江1, 2, *，李洪2，林松盛2，石倩2，韦春贝2，苏一凡2，郭朝乾2
（1.广东工业大学材料与能源学院，广东 广州 510006；2.广东省新材料研究所，现代材料表面工程技术国家工程实验室，广东省现代表面工程技术重点实验室，广东 广州 510651）
摘要：以真空阴极多弧离子镀技术在P(100)型单晶抛光硅衬底和YG6 硬质合金上制备了四面体非晶碳(ta-C)薄膜。用扫描电镜(SEM)测量薄膜厚度，并观察其表面及断面形貌；用X 射线衍射仪(XRD)分析薄膜的相组成；用拉曼光谱标定薄膜中的sp3 键和sp2 键；用轮廓仪测量薄膜的表面粗糙度；用划痕法和压痕法测试了膜/基结合强度。在0.5 ~ 1.5 μm 的厚度范围内，随着ta-C薄膜厚度增加，薄膜的sp3 键含量逐渐降低，表面碳颗粒数量及尺寸逐渐增加，与YG6 基体的结合强度不断降低。0.5 μm 厚的ta-C 薄膜具有最小的表面粗糙度(0.17 μm)，最高的结合强度(剥离时的临界载荷为61 N，压痕等级为HF2)，表现出最优的综合力学性能。
文章编号：1004 – 227X (2018) 16 – 0716 – 07
Structure and properties of tetrahedral amorphous carbon thin films with different thicknesses prepared by vacuum cathodic multi-arc ion plating // LI Yu-ting, DAI Ming-jiang*, LI Hong, LIN Song-sheng, SHI Qian, WEI Chun-bei, SU Yi-fan, GUO Chao-qian
Abstract: Tetrahedral amorphous carbon (ta-C) thin films were prepared on P(100)- type polished single crystal silicon substrate and YG6 cemented carbide by vacuum cathodic multi-arc ion plating. The film thickness was measured by scanning electron microscopy (SEM) and the surface and cross-section morphology of the films were characterized. The phase compositions of the thin films were analyzed by X-ray diffraction (XRD). The sp3 and sp2 bonds were examined by Raman spectroscopy. The roughness of the thin films was measured using a surface profiler. The bonding strength between film and substrate was tested by scratch and indentation methods. The increase of thickness from 0.5 μm to 1.5 μm decreases the content of sp3 bonds in ta-C thin film gradually, makes the number and size of carbon particles on film surface become larger, and reduces the bonding strength of ta-C thin film on YG6 substrate. The ta-C thin film with a thickness of 0.5 μm has the minimum surface roughness (0.17 μm) and the maximum bonding strength (characterized by a critical force of 61 N to start peeling and an HF2 grade for the indentation test), showing the optimal comprehensive mechanical properties.
Keywords: vacuum cathodic multi-arc ion plating; cemented carbide; tetrahedral amorphous carbon; thin film; morphology;roughness; Raman spectroscopy; bonding strength
First-author’s address: School of Materials and Energy, Guangdong University of Technology, Guangzhou 510006,China