王艳妮1, 2，靳军宝1, 3，白光祖1，吴新年1, *，郑玉荣1，王鑫1, 2（1.中国科学院兰州文献情报中心，甘肃 兰州 730000；2.甘肃省高级专家协会，甘肃 兰州 730000；3.中国科学院大学，北京 100049）
文章编号：1004 – 227X (2018) 19 – 0906 – 07
Analysis on key technologies relating to rolled copper foil based on global patent applications // WANG Yan-ni,JIN Jun-bao, BAI Guang-zu, WU Xin-nian*, ZHENG Yu-rong, WANG Xin
Abstract: The global current status of research and development of rolled copper foil research was analyzed based on analysis on the patents from the Derwent Innovations Index (DII) database and some commonly used information analysis tools such as TDA (Thomson Data Analyzer), including patent application trend, classification of key patents, as well as geographical distribution of top assignees and their main technologies and core patents. The developing trend of the technological innovation of rolled copper foil was revealed. Most of the assignees and the core patents were from Japan, China, and a few other countries. The main research and development directions of rolled copper foil were focused on the preparation of rolled copper foils for printed circuit boards, the preparation of copper clad laminates, and the optimization of grain orientation of rolled copper foils by heat treatment. Some suggestions were proposed based on the comparison between the classification and distribution of Japanese and Chinese patents for the further development of rolled copper foil in China.
Keywords: rolled copper foil; core patent; technical distribution; international patent classification
First-author’s address: Lanzhou Information Center, Chinese Academy of Sciences, Lanzhou 730000, China