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182304-电解蚀刻法制备印制电路板精细线路的工艺优化

   作者:付登林,陈际达,等    单位:重庆大学化学化工学院    日期:2018-12-28     浏览:569    评论:0    
提示:中文核心期刊,中国科技核心期刊!DOI: 10.19289/j.1004-227x.2018.23.004电解蚀刻法制备印制电路板精细线路的工艺优化付登林1,
 

中文核心期刊,中国科技核心期刊!


DOI: 10.19289/j.1004-227x.2018.23.004

电解蚀刻法制备印制电路板精细线路的工艺优化

付登林1,陈际达1, *,鲁蓝锶1,廖超慧1,文亚男1,嫣婷1,覃新2,陈世金3,何为4(1.重庆大学化学化工学院,重庆 401331;2.江苏博敏电子股份有限公司,江苏 盐城 224100;3.梅州博敏电子股份有限公司,广东 梅州 5140004;4.电子科技大学能源与材料学院,四川 成都 610054)

摘要:以蚀刻因子为指标,通过正交试验对电解蚀刻法制备印制电路板(PCB)精细线路的工艺参数进行优化,得到电解蚀刻的最优条件为:2,5−二巯基−1,3,4−噻二唑(DMTD)15 mg/L,CuCl2 30 g/L,HCl 0.48 mol/L,阳极电流密度2.4 A/dm2。在最优工艺条件下,蚀刻因子平均达到7.53,所得PCB 精细线路平整均匀,无毛边、短路、断路等缺陷,阴极同步回收得到的铜板呈赤红色,回收率为47.67%。

关键词:印制电路板;精细线路;电解蚀刻;正交试验;铜;回收

中图分类号:TQ153.14 

文献标志码:A

文章编号:1004 – 227X (2018) 23 – 1085 – 05

Optimization of electrolytic etching process for preparing fine lines of printed circuit board // FU Deng-lin,CHEN Ji-da*, LU Lan-si, LIAO Chao-hui, WEN Ya-nan, YAN Ting, QIN Xin, CHEN Shi-jin, HE Wei

Abstract: The parameters of electrolytic etching process for preparing fine lines of printed circuit board (PCB) were optimized through orthogonal test using etching factor as indicator. The optimal conditions of electrolytic etching are as follows: 2,5-dimercapto-1,3,4-thiadiazole (DMTD) 15 mg/L, CuCl2 30 g/L, HCl 0.48 mol/L, and anodic current density 2.4 A/dm2. The average etching factor under the optimal conditions reached 7.53, the fine lines obtained on PCB were level and uniform without defects such as rough edge, short circuit, and broken circuit. The copper plate simultaneously reclaimed at the cathode was reddish with a recovery of 47.67%.

Keywords: printed circuit board; fine line; electrolytic etching; orthogonal test; copper; reclamation

First-author’s address: School of Chemistry and Chemical Engineering, Chongqing University, Chongqing 401331, China

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