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190401-氨基磺酸盐体系复合电镀镍−金刚石溶液的添加剂研究

   作者:郭文晓,刘平,等    单位:上海理工大学材料科学与工程学院    日期:2019-03-01     浏览:413    评论:0    
提示:中文核心期刊,中国科技核心期刊!DOI: 10.19289/j.1004-227x.2019.04.001氨基磺酸盐体系复合电镀镍金刚石溶液的添加剂研究郭文

中文核心期刊,中国科技核心期刊!    



DOI: 10.19289/j.1004-227x.2019.04.001

氨基磺酸盐体系复合电镀镍−金刚石溶液的添加剂研究

郭文晓,刘平,刘新宽*,陈小红,李伟,马凤仓,何代华,张柯(上海理工大学材料科学与工程学院,上海 200093)

摘要:以氨基磺酸盐镀镍液在黄铜基体上进行镍−金刚石复合电镀,采用正交试验考察了金刚石添加量以及FC-001 全氟环氧烷基类非离子表面活性剂、双十二烷基二甲基氯化铵(D1221)和乙二胺四乙酸(EDTA)这三种添加剂的配比对镀层结合强度与孔隙率的影响,确定了最优镀液配方为:Ni(NH2SO3)2ꞏ7H2O 500 ~ 550 g/L,NiCl2ꞏ6H2O 10 ~ 12 g/L,H3BO3 35 ~ 40 g/L,金刚石80 g/L,FC-001 0.15 g/L,D1221 0.2 g/L,EDTA 1.5 g/L。所得镀层结合强度为17.305 MPa,孔隙率0.062。偏光显微镜和扫描电镜观察显示,金刚石在镀层中分布较均匀,其复合量为207 47 个/cm2。该工艺适用于制备金刚石线锯。

关键词:镍;金刚石;复合电镀;氨基磺酸盐;添加剂;结合强度;孔隙率;正交试验

中图分类号:TQ153.2 

文献标志码:A 

文章编号:1004 – 227X (2019) 04 – 0143 – 04

Study on additives for nickel–diamond composite electroplating in a sulfamate bath // GUO Wen-xiao, LIU Ping,LIU Xin-kuan*, CHEN Xiao-hong, LI Wei, MA Feng-cang, HE Dai-hua, ZHANG Ke

Abstract: Ni–diamond composite electroplating was carried out on brass in a sulfamate bath. The effects of diamond amount and the proportion of three additives i.e. FC-001 perfluorocycloalkyl-based nonionic surfactant, didecyldimethylammonium chloride (D1221), and ethylenediaminetetraacetic acid (EDTA) on adhesion strength and porosity of coating were studied by orthogonal test. The optimal bath composition was determined as follows: Ni(NH2SO3)2ꞏ7H2O 500-550 g/L,NiCl2ꞏ6H2O 10-12 g/L, H3BO3 35-40 g/L, diamond 80 g/L, FC-001 0.15 g/L, D1221 0.2 g/L, and EDTA 1.5 g/L. The coating obtained therefrom had an adhesion strength of 17.305 MPa and a porosity of 0.062 pores per square centimeter. The observation by polarized light microscope and scanning electron microscope showed that the diamonds distributed uniformly in the coating where there are 20 7 47 diamonds per square centimeter. The process is suitable for making diamond wire saws.

Keywords: nickel; diamond; composite electroplating; sulfamate; additive; adhesion strength; porosity;orthogonal test

First-author’s address: School of Materials Science and Engineering, University of Shanghai for Science and Technology, Shanghai 200093, China

 

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