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190501-焦磷酸盐溶液电沉积光亮锡镍合金的电化学行为

   作者:镀涂学堂小编    单位:电镀与涂饰    日期:2019-03-26     浏览:716    评论:0    
提示:中文核心期刊,中国科技核心期刊!DOI: 10.19289/j.1004-227x.2019.05.001焦磷酸盐溶液电沉积光亮锡镍合金的电化学行为刘喜亚,
 

中文核心期刊,中国科技核心期刊!    



DOI: 10.19289/j.1004-227x.2019.05.001

焦磷酸盐溶液电沉积光亮锡镍合金的电化学行为

刘喜亚,万传云*(上海应用技术大学化学与环境工程学院,上海 201418)

摘要:通过线性扫描伏安法研究了焦磷酸盐溶液体系中铜电极上电沉积锡镍合金的电化学行为,分析了各种镀液成分对电沉积锡镍合金的阴极过程与沉积层组成及表面形貌的影响。结果表明,焦磷酸钾作为主配位剂起配位金属离子,增大阴极极化的作用;辅助配位剂柠檬酸钠的加入可扩大光亮区的电流密度范围,促进锡镍共沉积;添加剂氯化铵使金属离子析出电位正移,对镍具有明显的去极化作用,有利于金属共沉积;糖精钠(光亮剂)对金属离子的析出具有均匀阻化作用。焦磷酸钾、柠檬酸钠和氯化铵添加量的改变会对锡、镍的相对析出速率产生一定的影响,也影响镀层的晶粒尺寸,而糖精钠对锡、镍离子的放电相对速率没有产生大的影响,因此在其使用范围内镀层的组成都较为稳定。

关键词:锡镍合金;焦磷酸盐镀液;共沉积;线性扫描伏安法;微观形貌

中图分类号:TQ153.2 

文献标志码:A

文章编号:1004 – 227X (2019) 05 – 0189 – 05

Electrochemical behavior of bright tin–nickel alloy electrodeposition from pyrophosphate bath // LIU Xi-ya,WAN Chuan-yun*

Abstract: The electrochemical behavior of bright Sn–Ni alloy electrodeposition on copper substrate in a pyrophosphate bath was studied by linear sweep voltammetry. The effects of the components in the bath on cathodic process in electrodeposition of Sn–Ni alloy and the composition and surface morphology of deposit were discussed. The results showed that potassium pyrophosphate reacts as a primary complexing agent with metal ions, increasing the cathodic polarization. The addition of sodium citrate as an auxiliary complexing agent extends the range of current density for producing bright deposit and promotes the codeposition of Sn and Ni. The additive NH4Cl has a depolarization effect on nickel deposition and makes a positive shift of codeposition potential, contributing to the codeposition of Sn and Ni. Sodium saccharin, a brightening agent, inhibits the discharge of Sn2+ and Ni2+ homogeneously. The concentrations of potassium pyrophosphate, sodium citrate, and NH4Cl affect not only the deposition rate of Sn relative to Ni, but also the grain size of deposit. The composition of deposit is almost constant when sodium saccharin is in its working concentration due to the fact that sodium saccharin has slight effect on the discharge rate of Sn2+ relative to Ni2+.

Keywords: tin–nickel alloy; pyrophosphate bath; codeposition; linear sweep voltammetry; surface morphology

First-author’s address: School of Chemical and Environmental Engineering, Shanghai Institute of Technology,Shanghai 201418, China

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