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190502-微机电系统器件电镀镍厚度均匀性的模拟与改进

   作者:镀涂学堂小编    单位:电镀与涂饰    日期:2019-03-26     浏览:1109    评论:0    
提示:中文核心期刊,中国科技核心期刊! DOI: 10.19289/j.1004-227x.2019.05.002微机电系统器件电镀镍厚度均匀性的模拟与改进刘瑞,许
 

中文核心期刊,中国科技核心期刊!  



DOI: 10.19289/j.1004-227x.2019.05.002

微机电系统器件电镀镍厚度均匀性的模拟与改进

刘瑞,许文杰,袁妍妍*(江苏科技大学材料科学与工程国家级实验教学示范中心,江苏 镇江 212003)

摘要:微机电系统(MEMS)金属基器件经常存在电镀镍层厚度不均匀的问题,采用大型有限元分析软件ANSYS 对电镀过程的电场分布进行建模分析。探讨了片内辅助阴极的线宽及其与微结构单元的距离对电镀层均匀性的影响。通过正交试验对片外辅助阴极相关的参数──挡板通孔直径、挡板与基底的距离、铜环壁厚及其与基底的距离进行优化,得到合理的电镀工艺条件。

关键词:微机电系统;金属基器件;电镀;厚度均匀性;建模;辅助阴极

中图分类号:TQ153.12 

文献标志码:A 

文章编号:1004 – 227X (2019) 05 – 0194 – 06

Simulation and improvement for thickness uniformity of electroplated nickel coating on metal components ofmicro-electro-mechanical system// LIU Rui, XU Wen-jie, YUAN Yan-yan*

Abstract: In respect of the thickness nonuniformity of nickel coatings frequently occurred in electroplating on metal components of micro-electro-mechanical system (MEMS), the distribution of electric field during electroplating process was modeled and analyzed using ANSYS, a finite element analysis software. The effects of the size of in-chip auxiliary cathode and its spacing with respect to microelement on the uniformity of nickel coating were discussed. The parameters related to the out-chip axillary cathode including the size of through hole on baffle, the spacing between baffle and substrate, as well as the wall width of copper ring and its spacing with respect to substrate were optimized by orthogonal test, and suitable conditions for electroplating were obtained.

Keywords: micro-electro-mechanical system; component with metal substrate; electroplating; thickness uniformity;modeling; auxiliary cathode

First-author’s address: National Demonstration Center for Experimental Materials Science and Engineering Education,Jiangsu University of Science and Technology, Zhenjiang 212003, China

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